abstract blue background with white dots creating a wave

Copper

DIASTAR Series

The DIASTAR Series, including DIASTAR 100 and DIASTAR Strike, is a cyanide-free, alkaline copper technology that produces uniform, fine-grained, bright, or semi-bright deposits and is designed to prepare component surfaces for subsequent plating processes such as acid copper or nickel plating.

The resulting coatings are even, pore-free, ductile, and highly adherent on aluminum, brass, steel, and zinc die-cast substrates.

Operational advantage

The DIASTAR Series delivers exceptionally high yields, minimal reject rates, and outstanding performance across a wide operating window.

Versatility

Offering exceptional substrate flexibility, the DIASTAR Series features a flash deposit option for superior adhesion, providing the perfect foundation for beautiful antique finishes.

Sustainability

The process enhances workplace safety by eliminating cyanide handling and on-site storage, substantially reducing the environmental footprint of operations.